QFN Packaging Tape, Leadframe Back Side Film
QFN Packaging Tape, Leadframe Back Side Film * SKYMART TAPING SOLUTION – DAF, QFN, Backgrind Tape, Package & Wafer Sawing Tape * Our Products * Home
QFN (Back Side Film) tape is high resisting viscosity tape that prevents EMC Molding Leakage by sticking Leadframe Back side inside package of semi conductor.
Our QFN Tape is composed of silicon with resisting high temperature, acryil field, resisting heat in PI field, heat plasticity adhesion layer on one side of polyimide film.
Our Coating Processes
QFN Packaging Processes
Our QFN Tape has the following technical advantages:
Storage Condition
* 12 months after the date of manufacture when kept hermetically sealed and stored under the following condition without direct sunshine
* Temperature: 22+/-7oC, Humidity: Below 60% RH
Email to sales@Skymart-Group.com for immediate reply.