SKYMART TAPING SOLUTIONS – DIE ATTACH FILM, QFN TAPE, PACKAGE SAWING TAPE, DIE CARRIER FILM, MOLD RELEASE FILM
SKYMART TAPING SOLUTION – Die Attach Film, QFN Tape, Package Sawing Tape, EMI Die Carrier, Mold Release Film * Our Products * Home
SKYMART supplies single or double-sided adhesive tape used in semiconductor assembly process for attaching leadframes to chips, or bonding metal circuits. These tape are produced under high-degree cleanroom conditions comparable to those of Semiconductor lines.
SKYMART supplies single or double-sided adhesive tape used in semiconductor assembly process for attaching leadframes to chips, or bonding metal circuits. These tape are produced under high-degree cleanroom conditions comparable to those of Semiconductor lines.
On Die Attached Film, besides the standard Die-to-Die, Die-to-Substrate applications for multi-levels Stacked Die Packages, our products are qualified by the Finger Print Sensor (FPS) industries for Die-to-Glass and Die-to-Ceramic Applications.
On QFN Tape, as of 1Q1998, our products cover 60% market share in North Asia. All major Assembly Subcontractors and Leadframe Makers have already enjoying business growth with our good value products.
On Package Sawing Tape, Mold Release Film and Plating Tape, we are growing rapidly since 2017 and will continue into 2019.
For information and Business Partnership, please email to: sales@Skymart-Group.com