UV & Non UV Wafer Dicing Tape, WAFER SAWING TAPE
QFN/MLP Package Sawing Tape, Wafer Dicing Tape * SKYMART TAPING SOLUTION – DAF, QFN, Backgrind Tape, Package & Wafer Sawing Tape * Our Products * Home
WAFER DICING TAPE
Our Wafer Dicing Tape is formulated using our partner’s resin synthesis technologies (since 1985) in organic materials for semiconductors include a variety of films, adhesives, underfill, and solder resist ink, and these demonstrate a far better performance than the products of other companies.
Our products are already proven both in mass production in Asia and Europe. We offer values in matching technical performance in lower cost as compared to our friendly competitors in US and Japan.
DICING TAPE PROCESS
OUR TAPE FEATURES
- No Wafer Contamination by Adhesive Residue
- Easy Pick up
- Excellent Chipping Performance
- Stable Adhesive Strength after UV in the In-line Process
GENERAL PROPERTY
