2-In-1 DAF Tape, Die Attach Film; FOW, Film Over Wire (www.dieattachfilm.com)
2-In-1 DAF Tape, Die Attach Film; FOW, Film Over Wire (www.dieattachfilm.com) * SKYMART TAPING SOLUTION – DAF, QFN, Backgrind Tape, Package & Wafer Sawing Tape * Our Products * Home
DAF Tape is composed of Die bonding film and dicing film. It’s used by sticking backside of wafer, which makes easy dealing of thin film wafer possible. Our product is protected by hetero-film after adhesive is added on UV Dicing Film. It is applied in QDP, MCP (Multi Chip Package) & Stacked Package.
2-in-1 DAF Attach Film
Our Manufacturing Processes
Applications of 4 Stacked Die
Our Recommended Process Condition
Storage Condition
Email to sales@Skymart-Group.com for immediate reply.